Photosensitive device read by charge transfer

ABSTRACT

This device incorporates a photosensitive (1) constituted by a matrix of photosensitive points. Each photosensitive point has a charge reading diode D 1 . Metallic connections (C 1  to C 4 ) connect the reading diodes of the same column to a single diode (D 2 ), followed by a grid G 2  raised to a constant potential (V 2 ). The operation of the device involves the repetition of two stages, i.e. stage T 1  and stage T 2 . During stage T 1  parasitic charges, due for example to too intense illumination, are transferred from diodes D 1  to diodes D 2  and are removed by a diode (D 5 ). During stage T 2  the signal charges stored by the points of one line of the matrix are transferred into a memory and then into a charge transfer read register (R 2 ). The register reads these charges during the following stages T 1  and T 2  until the time when the register receives the charges corresponding to the reading of the following line.

BACKGROUND OF THE INVENTION

The present invention relates to a photosensitive device read by charge transfer. It also relates to a television camera incorporating such a device.

The prior art, particularly the work by C. H. SEQUIN and M. F. TOMPSETT entitled "Charge transfer devices", pages 152 to 169 mainly describes two types of photosensitive device using charge transfers. In the first type of photosensitive charge transfer device light radiation is transmitted to charge transfer registers. There are numerous possible organizations of the registers exposed to the radiation and the charge transfer registers used for storing the charges after reading. The most frequently encountered organizations are of the "field or frame transfer type" or "the interline structure type". These devices have the disadvantage of requiring large charge transfer device surfaces, it being difficult at present to obtain high efficiency levels for the production of such large surfaces. The second type of photosensitive device is of the charge injection device-type or C.I.D. and does not suffer from the aforementioned disadvantage. These devices have a matrix of photosensitive points constituted by two MOS capacitors connected by a grid. One of the capacitors is exposed to the light radiation. The charges induced beneath this capacitor are periodically transferred to the adjacent capacitor and the charges are read by an MOS transistor. Two digital shift registers permit the addressing of each point with a view to the reading thereof. The capacitors of the same line which are exposed to the radiation are connected in parallel and addressed by one of the registers, whilst the capacitors of the same column used for reading are connected in parallel and addressed by the other register. The charge injection device have the disadvantage of requiring a re-injection of the charges into the semiconductor substrate where the capacitors are integrated during or after the reading of the charges. This re-injection requires the use of substrates which have undergone epitaxy or collecting diffusions in order to be effective. It is also difficult to control and can lead to remanence if it is incomplete. Moreover, in charge injection devices the charges are read over a high capacitance, which reduces the signal/noise ratio and said capacitance is dependent on the number of lines.

Furthermore, the article which appeared in the I.E.E.E. Journal of Solid-State Circuits, vol. SC 14, no. 3, June 1979, pp. 604 to 608 disclosed a photosensitive device having a C.I.D.-type matrix read by charge transfer (cf. in particular FIGS. 7 and 8 of the article and the comments thereon). In this device the reading capacitors are addressed by a C.C.D. (Charge Coupled Device) shift register. Each line of the matrix is read in two stages. In the first stage the potential of all the reading capacitors is fixed. There is a transverse transfer of charges into the C.C.D. register and removal of said charges by MOS transistors TG₂. In the second stage the transfer of charges beneath the reading capacitors leads to the injection into the C.C.D. register of signal charges which are read in series by longitudinal transfer.

The charge transfer is of the "Bucket Brigade" type, i.e. it is carried out by means of the analog of a suturation-polarized MOS transistor.

A disadvantage of this device is that, to be effective, the transfer requires a relatively long time. However, for this device to be usable by a television camera, the first stage and also the second up to the injection of the signal charges into the C.C.D. register must take place during the line return time, which is only 12 μs in the 625 line standard. During the line reading time the charges injected into the C.C.D. register are read in series and there is a re-injection of charges into the semiconductor substrate. However, an advantage of this device compared with the conventional C.I.D. devices is that the reading of the charges no longer takes place over a high capacitance and is no longer dependent on the number of lines.

BRIEF SUMMARY OF THE INVENTION

The present invention relates to a photosensitive device read by charge transfer having numerous advantages compared with the prior art devices.

The device according to the present invention has:

n lines of m photosensitive points, each photosensitive point being constituted by the integration on a semiconductor substrate of an MOS capacitor (C₀), having a grid G₀ common to the points of the same line and a reading diode D₁ separated from grid G₀ by a screen grid G₁ raised to a constant potential (V₁), m metallic connections (C₁ . . . C_(m)) connecting in parallel n diodes belonging to different lines;

m diodes D₂ integrated on to the same semiconductor substrate to which lead the m metallic connections, said diodes being followed by a grid G₂ raised to a constant potential (V₂);

removing means on a diode (D₅) of the charges accumulated on diodes D₁ and D₂ during each time interval when none of the grids G₀ is at zero;

at least one shift register (R₁)making it possible to periodically zero each grid G₀ and remove the signal charges on diodes D₁, and diodes D₂ ;

means ensuring the transfer of the signal charges arriving beneath diodes D₂ to a charge transfer read register R₂ with m parallel inputs and a series output.

According to a preferred embodiment the device according to the invention has an integrated memory on the semiconductor substrate following the sequence of diodes D₂ and beneath which the signal charges are collected before being transferred into the read register R₂.

The most important advantages of the invention are described hereinafter. Due to the fact that simultaneously with the reading of the signal charges they are removed from the photosensitive area of the device by transfer of said charges from the reading diodes D₁ to diodes D₂ across metallic connections C₁ . . . C_(n) there is no longer any need, as in the conventional C.I.D. devices or in the case of the C.I.D. device of the article in I.E.E.E. referred to hereinbefore to re-inject the charges into the substrate. In addition, the reading diodes D₁ also fulfil an anti-blooming function. Thus, when a photosensitive point is too intensely illuminated, the storage capacitance C₀ of these charges for this point overflows into the adjacent diode D₁ and between two readings of a line (stage T₂) the charges which have overflowed into diodes D₁ are removed (stage T₁). Moreover, n diodes D₁ are connected in parallel by each connection C_(i), the charges due to the excessive illumination can be distributed over n diodes before overflowing into the substrate. The diodes D₁, ensuring both the removal of the charges from the photosensitive part and the anit-blooming function make it possible to obviate the use of horizontal collecting diffusions and vertical electrodes serving to isolate the cells from one another as is generally the case in C.I.D. devices (cf. the guard stripes and field shield electrodes in FIGS. 2, 3 and 4 of the I.E.E.E. document referred to hereinbefore, and the comments on these drawings). In addition, the device according to the invention generally has a memory where the charges corresponding to the reading of a line of photosensitive points are temporarily stored before being transferred into the charge transfer read register. In the device according to the invention, like that described in the I.E.E.E. article, the transfer of charges from each line to the read register is of the "Bucket Brigade" type. Through adding a memory there is a time equal to that of a line reading (i.e. 52 μs for the 625 line TV standard) for carrying out the removal of parasitic charges on diodes D₁ and D₂ and the transfer of a line into the memory, whereas in the device described in the I.E.E.E. article these times are reduced to the line return time (12 μs).

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is described in greater detail hereinafter relative to non-limitative embodiments and the attached drawings, wherein show:

FIG. 1 a diagrammatic plan view of an embodiment of the device according to the invention.

FIG. 2a a longitudinal sectional view of the device of FIG. 1 and FIGS. 2b to 2g diagrams illustrating the operation of the device.

FIG. 3 a diagrammatic plan view of another embodiment of the photosensitive area of the device according to the invention.

FIG. 4 control signals which can be applied to the device according to the invention.

FIG. 5 a diagrammatic plan view of an embodiment of a device for injecting a supplementary quantity of charges Q₀ into the photosensitive device according to the invention.

FIG. 6a a sectional view of the device in FIG. 5 and FIGS. 6b to 6e diagrams illustrating the operation of this device.

FIG. 7 a diagrammatic plan view of another embodiment of the memory, the parasitic charge removal device and the read register of the photosensitive device according to the invention.

FIGS. 8a and 9a two cross-sectional views of the embodiment of FIG. 7 and FIGS. 8b, 8c and 9b, 9c diagrams illustrating the operation of this embodiment.

FIGS. 10a to 10d control signals which can be applied to the device according to the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In the various drawings the same references designate the same components but, for reasons of clarity, the dimensions and proportions of these components have not been respected.

FIG. 1 is a diagrammatic plan view of an embodiment of the device according to the invention. FIG. 2a is a longitudinal sectional view of the device of FIG. 1.

The photosensitive device according to the invention essentially comprises three parts, namely a photosensitive area 1, a memory and parasitic charge transfer device 2 and a read register 3. Each of these parts will be successively described, as will the manner of their interconnection.

The photosensitive area 1 has a matrix of photosensitive points. In FIG. 1 this matrix comprises four lines and four columns and therefore sixteen photosensitive points. Each photosensitive point is constituted by the integration on a semiconductor substrate 4, which is generally of silicon of:

An MOS capacitor of capacitance C₀ constituted by a horizontal grid G₀ common to the points of the same line.

Vertical isolating diffusions D₁ on each grid G₀ determine the capacitance C₀ of each photosensitive point.

A collecting diode D₁₀ which is sensitive to the limited wavelengths to which the grids G₀ are opaque. The diodes D₁₀ are locally diffused in the vicinity of grids G₀, said diodes being arranged in matrix form. In FIG. 1 each line of diodes D₁₀ is arranged along the edge of one of the large sides of one of the grids G₀, which are rectangular.

A screen grid G₁ which is raised to a constant potential V₁. In FIG. 1 grid G₁ is horizontal and common to all the photosensitive points of the same line. Like grid G₀ grid G₁ is rectangular and borders the other large side of G₀, which is not occupied by diodes D₁₀.

A reading diode D₁. The reading diodes D₁ are arranged in matrix form and four vertical metallic connections C₁ to C₄, which are generally of aluminium, connect the four reading diodes D₁ of the same column in parallel.

The collecting diodes D₁₀ must be strongly coupled to grids G₀ by edge capacitances C_(B), which are high compared with the capacitances C_(D10) of diodes D₁₀ to the semiconductor substrate 4. It is necessary to have: C_(B) >>C_(D10). For this purpose the common perimeter between each diode D₁₀ and the adjacent grid G₀ is increased to the maximum. Thus, the potential of diodes D₁₀ precisely follows the surface potential beneath the adjacent grid G₀. Diodes D₁₀ could also be positioned between grids G₀ and G₁.

The diffusion zone corresponding to each diode D₁₀ could also be extended under the adjacent grid G₀. It allows to increase the coupling between the collecting diodes D₁₀ and the grids G₀ : so, the removing of the parasitic charges is realized easier by each photosensitive point; moreover, it increases the quantity of charges stored by each photosensitive point for a given potential variation on the grid G₀.

Grids G₀ receive two types of polarization.

On the one hand all the grids G₀ of the photosensitive area are exposed to a constant potential V₉ permitting the integration of the charges at each photosensitive point as a function of the illuminations received by this point. Each grid G₀ is connected to one of the electrodes of an MOS transistor T₁ to T₄, whose other electrode is connected to the d.c. voltage V₉ and whose grid receives a potential V₈ making it possible to restore the potential V₉ on all the grids G₀. Potential V₈ can be a d.c. voltage or a voltage varying as a function of time. In the case where V₈ is a d.c. voltage, potential V₉ is restored on grid G₀, which was previously at zero, with a relatively long time constant and the value of the storage capacity of charges C₀ increases with time. This reduces the quantity of charges collected by heat generation. In the case where potential V₈ is a signal variable as a function of time, it is generally the passage of V₈ to the high level which renders transistors T₁ to T₄ conductive and instantaneously restores potential V₉ on all the grids G₀.

On the other hand each grid G₀ periodically receives a zero potential, which leads to the signal charges stored under said grid being transferred beneath diodes D₁, whilst the other grids G₀ are kept at potential V₉ and charge integration continues under these grids. In order to periodically zero one of the grids G₀, each grid G₀ is connected to one of the electrodes of an MOS transistor T₀₁ to T₀₄, whose other electrode is connected to earth and whose grid receives the control signals L₁ to L₄ from four successive stages of a shift register R₁. When one control signal L_(i) passes to high level one of the grids G₀ is zeroed.

Reference will now be made to the memory and the parasitic charge removal device 2, which are generally integrated on to the same semiconductor substrate as that into which is integrated the photosensitive area 1. The connection between parts 1 and 2 of the photosensitive device according to the invention is ensured by four diodes D₂ which are integrated on to the semiconductor substrate 4 and to which lead the metallic connections C₁ to C₄. Diodes D₂ are followed by a horizontal grid G₂ common to all the diodes and which is raised to a constant potential V₂. Grid G₂ fixes at V₂ -V_(T) the potential on diodes D₂ and on the reading diodes D₁ connected to diodes D₂, V_(T) representing the threshold voltage beneath grid G₂.

Grid G₂, which is connected to constant potential V₂, as well as grids G₁ connected to constant potential V₁ prevent the transmission of interference on connections C₁ to C₄, which would have the effect of introducing into the memory parasitic or spurious charges superimposed on the signal charges. In charge transfer devices it is particularly important to protect against parasitic charges, whose amplitude can vary from one point to another in the circuit as a function of geometrical variations of the components and which limit the dynamics of the signal.

Moreover, grids G₁ isolate the photosensitive area 1 from interference from connections C_(i) and from part 2 of the device and in the same way grid G₂ isolates part 2 from interference from connections C_(i) and part 1.

Grid G₂ is followed by a grid G₃ and like the former is horizontal and singular. Grid G₃ is controlled by a periodic signal V₃. The passage of V₃ from a high level to a low level makes it possible to prevent the rearward return of charges transferred from diodes D₁ and D₂ to the memory.

The memory is formed by four aligned diodes D₄, which are followed by a single horizontal grid G₄ raised to a variable potential V₄. Two types of charge are successively stored in this memory, namely parasitic charges accumulated beneath diodes D₁ and D₂ during each time interval when none of the grids G₀ is at zero and signal charges resulting from the zeroing of the grid G₀.

The memory is followed by a parasitic charge removal device constituted by a single, horizontal grid G₅, followed by a single diode D₅. Grid G₅ and diode D₅ are connected to a variable potential V₅.

On semiconductor substrate 4 isolating diffusions d₂ delimit in per se known manner the area of the substrate which is reserved for the processing of charges from each column of photosensitive points and isolate diodes D₂ from diodes D₁.

The third part of the photosensitive device according to the invention will now be described, i.e. the read register 3.

The read register 3 is generally integrated into the same semiconductor substrate 4 as the memory and the parasitic charge removal device. However, it is isolated therefrom by a slotted isolating diffusion area d₃.

Within the slots there are four aligned diodes D₆ connected by metallic connections C'₁ to C'₄ to the four diodes D₄ of the memory. In this way the signal charges are transferred from the memory to the read register. Diodes D₆ are followed by a single, horizontal grid G₆ connected to the same variable potential V₄ as the memory grid G₄. Grid G₆ is followed by a single, horizontal grid G₇ connected to a variable potential V₇ and which permits during its passage to high level the transfer of signal charges to the actual read register R₂.

In FIG. 1 read register R₂ is a C.C.D. register with two phases .0.1 and .0.2. This register has a succession of storage electrodes and charge transfer electrodes arranged over an extra insulant thickness with respect to the storage electrodes. Every other storage electrode leads to the lower end of the slotted isolating diffusion area d₃ and consequently receives no charges. Charges are transferred horizontally into register R₂, as indicated by the arrow in FIG. 1. Thus, the signal charges of one line of photosensitive elements are read in series. An isolating diffusion d₄ determines the lower limit of the channel transferring the charges into register R₂.

It is as a result of the presence of the parasitic charge removal device that the connection between the memory and the read register 3 must be by means of connections outside substrate C'₁ to C'₄. In the same way as for diodes D₁₀ and grid G₀, there must be a good coupling between diodes D₄ and grid G₄, as well as between diodes D₆ and grid G₆. Thus, each diode and part of the adjacent grid can be covered by an insulating layer and then by an aluminium layer. An electrical contact is then made through the insulant level with each grid.

The above description relates to the case of a matrix having four lines and four photosensitive columns. However, it is obvious that the description also applies to the case where the matrix has n lines of m photosensitive points, where n and m are positive integers.

The operation of the device according to the invention shown in FIGS. 1 and 2a will now be explained by describing FIGS. 2b to 2g. FIGS. 2b to 2g represent the evolution of the surface potential .0._(S) in the semiconductor substrate 4 at various times t₁ and t₆. The hached areas indicate the presence of minority carriers. FIGS. 2b to 2g only show the interface 5 and 7 of substrate 4 and the insulating layer covering them.

Times t₁ to t₆ are marked on FIGS. 4a to 4f, which represent the control signals liable to be applied to the device according to the invention. These control signals are periodic signals, whose amplitude varies between a low level and a high level.

FIGS. 4a and 4b show signals V₄ and V₃ of the same period ₂ ^(T). Signal V₃ returns to low level a very short time τ before V₄.

FIGS. 4c and 4d show signals V₅ and V₇ of the same period T. Signals V₅ and V₇ are in phase opposition with V₃. FIGS. 4e and 4f show signals L_(i) and L_(i+1), which are of the same period nT. They pass to high level a very short time τ after V₃ passes to high level and return to low level at the same time as V₃.

The operation of the device according to the invention involves the repetition of two separate stages of duration T₁ and T₂, which will be designated hereinafter by stage T₁ and stage T₂, the sum of T₁ and T₂ being equal to T.

During stage T₁ all the grids G₀ are raised to the potential V₉. The parasitic charges on all the diodes D₁ and D₂ are transferred to the memory and then to the parasitic charge removal device.

During stage T₂ only one of the grids G₀ of the photosensitive area is at potential 0, whilst the other grids G₀ are at potential V₉. The signal charges stored beneath the grid at potential 0 are transferred to diodes D₁ and D₂, then beneath the memory, before being transferred into the read register R₂ where they will be read during the following stage T₁.

The stages T₁ and T₂ will now be studied in detail.

Stage T₁

At time t₁ only signals V₃ and V₄ are at high level. All the grids G₀ are at potential V₉ and integration of the charges continues in each capacitor C₀ and on each diode D₁₀. The parasitic charges detected by diodes D₁ and D₂ in all the device are removed into the memory, this being made possible by grid C₃ which is at high level. These parasitic charges essentially result from an overflow of capacitors C₀ due to a too intense lighting. This is the anti-blooming function of diodes D₁. The parasitic charges can also be charges collected laterally by diodes D₁ and D₂.

At time t₂ -τ signal V₃ returns to zero and grid G₃ then isolates the memory from the photosensitive area. At time t₂ -τ signal V₅ also passes to high level and grid G₅ and diode D₅ are ready to receive the parasitic charges.

At time t₂ signal V₄ returns to zero and the parasitic charges distributed in equal manner beneath diode D₄, grids G₄, diodes D₆ and grids G₆ are transferred beneath the removal diode D₅.

At time t₃, as at time t₁, only signals V₃ and V₄ are at high level, this representing the end of stage T₁.

Stage T₂

At time t₄ signals V₃, V₄ and L_(i) are at high level. Grid G₀ of the photosensitive area, which is connected to MOS transistor T_(0i) controlled by signal L_(i) is then connected to zero. There is then a transfer of the signal charges stored by all the photosensitive points located beneath grid G₀ to diodes D₁ and D₂ and then into the memory. As in the case of parasitic charge removal, the transfer of charges into the memory takes place at a constant potential V₂ -V_(T) as a result of grid G₂. It has been seen hereinbefore that the transfer of charges into the memory, no matter whether they are parasitic charges or signal charges is of the Bucket-Brigade type, i.e. it takes place via the analog of a saturation-polarized MOS transistor, whose source is constituted by diodes D₁ and D₂, whose grid is constituted by grid G₂ raised to constant potential V₂ and whose drain is constituted by diode D₄ raised by grid G₄ to a potential V₄ higher than V₃. As has been stated hereinbefore to be effective this type of transfer requires a relatively long time. In the device according to the invention the existence of the memory provides a time equal to that of a line read for removing the parasitic charges to all the diodes D₁ and D₂ and the transfer of a line L_(i) into the memory. Thus, during this time register R₂ ensures the reading of a preceding line L_(i-1) of the matrix.

At time t₅ -τ with the signal charge transfer into the memory at an end, signals V₃ and L_(i) pass to low level, whilst signal V₇ passes to high level. Grid G₃ again isolates the connections C_(i) from the memory. Grid G₇ is raised to high level and opens the passage to the read register R₂.

At time t₅ signal V₄ passes to low level and there is a transfer of the signal charges which were distributed beneath diodes D₄, D₆ and grids G₄, G₆ into read register R₂. The transfer of the signal charges into the read register must take place during the line return time, whereas all the preceding stages from t₁ to t₅ -τ take place during the line read time. After time t₅ signal V₈ restores potential V₉ on grid G₀, whose content has been transferred to the read register. In the case where signal V₉ is a periodic signal, it can be identical to signal V₇.

At time t₆ the control signals again assume their value at time t₁. A new stage T₁ starts, whilst line L_(i) is read by register R₂, which continues during stage T₂ when the content of the following line L_(i+1) is transferred into the memory and ends at the next time t₅ -τ.

The photosensitive device according to the invention can receive the light radiation to be detected either by its front face where grids G₀ and G₁ are located, or by its rear face. In the case when the light radiation is transmitted to the front face of the device, grids G₀ must be photosensitive. They are then made from polycrystalline silicon or a semi-transparent metal. The reading diodes D₁ are then entirely covered with an insulating layer and then aluminium in order to prevent parasitic illumination. In the same way the memory, the parasitic charge removal device and the read register are covered with an opaque layer protecting them from light radiation, said layer possibly being a metal coating. In the case when the light radiation is transmitted to the rear face of the photosensitive device, the semiconductor substrate 4 carrying the photosensitive area 1 then has a reduced thickness. The metallic connections C₁ to C₄ make it possible to position the memory, the parasitic charge removal device and the read register a certain distance from the photosensitive area and on a part of substrate 4 whose thickness has not been reduced. This prevents parasitic illumination of these elements.

FIG. 3 is a diagrammatic plan view of another embodiment of the photosensitive area 1 of the device according to the invention. In this embodiment the photosensitive points are organized so as to be staggered from one line to the next.

Grids G₀, formed by a first polycrystalline silicon level are arranged horizontally. The grids are rectangular and have rectangular notches. Each notch contains a reading diode D₁. The reading diodes D₁ are staggered, because the notches are displaced by a half-pitch from grid G₀ to the next.

An opening forming a collecting area D₁₀ is placed between two notches on each grid G₀. In the case of FIG. 3 where the collecting areas D₁₀ are constituted by a single thin oxide area without diffusion and no longer by diodes as is the case in FIG. 1, the carriers created by the photons beneath the collecting areas link the capacitances C₀ created by grids G₀ by diffusion rather than by conduction. In the case of FIG. 3 each grid G₀ receives the carriers generated on each collecting area D₁₀ by the complete circumference of said collecting area. The replacement of the diodes by a single thin oxide layer for forming the collecting areas is of interest in the case where the condition C_(B) >>C_(D10) cannot be realized.

In this embodiment the grids G₁ are formed by a second polycrystalline level and are vertical. Each grid G₁ partly covers on the one hand one of the vertical edges of a notch made on each grid G₀ and on the other the reading diode D₁ located in said notch. The reading diode D₁ are thus arranged in alternating manner to the right and left of the vertical electrode G₁ from one line to the next.

On grids G₁ the aluminium connections C_(i) are isolated by a thick oxide layer. In FIG. 3 the connections C₁, C₂, C₃ are shown as broken lines. These connections address the reading diodes D₁₀ by contacts through the oxide layer.

Arranging the photosensitive points in a staggered manner and no longer in the form of a matrix leads to the advantages that the horizontal resolution of the photosensitive points is increased, the connections C_(i) are completely protected from any interference by grids G₁ raised to constant potential V₁ and in addition the gap between the grids made on the same polycrystalline silicon level is not critical. Thus, the short-circuit of two grids G₀ only affects two lines of the photosensitive area. For the first line the read signal is the sum of the signals of the two lines. The second line is read like a black line, because it is removed by the previous reading operation. Finally a short-circuit on grids G₁ has no effect on the operation of the device.

The pitch of the shift register R₁ used for the periodic zeroing of each grid G₀ is generally larger than the pitch of grid G₀. It is possible to use two registers R₁ and R'₁, whose pitch is double that of grids G₀. The registers are then positioned on either side of the photosensitive area. One of the registers addresses the grids G₀ of the even row and the other addresses the grids G₀ of the uneven row. Interlacing is facilitated by this organisation, which can be used at the same time as the staggered arrangement. Thus, one of the registers can address the grids G₀ of the uneven row and the photosensitive points to the right of connections C_(i), whilst the other register addresses the grids G₀ of the even rows and the photosensitive points to the left of connections C_(i).

It is apparent from the description of the device of FIG. 1 that the operation involves the repetition of two stages T₁ and T₂. The anti-blooming function is only performed during stages T₁. The surplus charges due to photosensitive points which have been too intensely illuminated and which overflow their reading diode D₁ are taken into account during stages T₂. The surplus charges due to a photosensitive point which has been too intensely illuminated are distributed over all the diodes D₁ connected to the reading diode D₁ of said too intensely illuminated point by the same metallic connection C_(i). Thus, the average signal level on this connection C_(i) is high. If this point is illuminated with an intensity B times higher than that producing the maximum quantity of charges Q level with a photosensitive point, the average level for the diodes connected to connection C_(i) is increased by quantity:

(B/N)·(T₁ /T)·Q, in which N represents the number of grids G_(O) of the photosensitive area 1. Thus, a photosensitive area having 500 grids G₀ and for which T₁ =T₂ can tolerate over-illumination B of approximately 1000.

To improve the resistance of the device to over-illumination it is advantageous to increase the duration of stage T₂ compared with that of stage T₁.

Stage T₂ is limited by the time necessary for carrying out the transfer of signal charges Q_(S) along each connection C_(i) to the memory. It has been seen that the transfer takes place across the equivalent of a saturated MOS transistor.

If the capacitance of connection C_(i) is called c_(i), the residual charge Q_(r) beneath the reading diodes D₁ connected by C_(i) is expressed: ##EQU1## in which C_(0x) is the capacity of grid G₂ per surface area, W the grid width, L its length and μ the mobility of the minority carriers of the substrate. Thus, for reducing the residual charge it is advantageous to reduce the capacity c_(i).

It would also appear that the low value signal charges Q_(S) are transmitted less well than the high value charges. Thus, the sensitivity of the device is lower for low light levels.

It is possible for significantly improve the transfer of small quantities of signal charges Q_(S) by superimposing a fixed charge Q_(O) thereon, which is obtained by increasing by Δ V the potential of grid G₂ at time t₄. In this case the transfer charge is written:

    Q.sub.S +Q.sub.O with Q.sub.O =c.sub.i ·ΔV.

At the output of the read register R₂ a signal superimposed on the fixed charge Q_(O) is obtained, which also facilitates the transfer of charges into the register.

In certain cases this process can have the disadvantage of adding to the signal a noise due to the variations of the capacity c_(i) from one connection C_(i) to the other, leading to variations in the quantity Q_(O) introduced from one column to the other.

FIGS. 5 and 6a are a diagrammatic plan view and a longitudinal sectional view of an embodiment of a device for injecting a quantity of supplementary charges Q_(O) into the photosensitive device according to the invention. With this device the quantities of injected charges Q_(O) are identical for all points of the photosensitive area and independent of the values of capacities c_(i) of connections C_(i).

This device is constituted by the integration on to a semiconductor substrate (which can be the same as that on to which is integrated the remainder of the photosensitive device) of a number of diodes D₇ which is the same as the number of connections C_(i). Four diodes D₇ are shown in FIG. 5 and are raised to a variable potential V₇. Two copolanar grids G₈ and G₉ follow said diodes and are raised to two constant potentials V₈, V₉ with V₈ being lower than V₉. Thus, the passage of diodes D₇ from a low level to a high level makes it possible to store a quantity of charges Q_(O) beneath G₉ such that:

Q_(O) =(V₉ -V₈)·C_(G).sbsb.9, in which C_(G).sbsb.9 represents the storage capacity beneath the grid G₉.

Thus, the quantity of charges Q_(O) stored beneath G₉ is independent of the threshold voltage variations beneath G₈ and G₉ from one photosensitive point to the other and only depends on the geometry of G₉ and its variation from one end to the other of the device can be reduced to a low level.

Vertical isolating diffusions d₄ delimit in per se known manner the area of the substrate reserved for the processing of charges from a single diode D₇.

FIGS. 6b to 6e are diagrams illustrating the operation of the device shown in FIG. 5 and 6a at times t₄, t₂, t₃ and again at t₄. These drawings only show the interface 9 of substrate 8 and the insulating layer covering them.

FIGS. 6b and 6c show the storage of the quantity of charges Q_(O) beneath grid G₉. Grid G₉ is followed by a grid G₁₁ and a storage electrode G₁₂, which are raised to a variable potential V₁₁. At time t₃ each quantity of charges Q_(O) is transferred from G₉ to beneath G₁₂. Grid G₁₂ is followed by a screen grid G₁₃ raised to a constant potential V₁₃. Following grid G₁₃ there are four diodes D₁₃ connected by metallic connections C"1 to C"4 to diodes D₁ and D₂, i.e. to connections C₁ to C₄.

At time t₄ potential V₁₁ passes to zero and leads to the transfer of each quantity of charges Q_(O) to beneath diodes D₁₃, D₁ and D₂, which are connected in parallel. Thus, charge Q_(O) is introduced at the same time t₄ as the signal charge Q_(S) from the read line. The generation of Q_(O) takes place on reading each line of photosensitive elements.

The geometry of the memory and the read register must be such that it is possible to store the total charge equal to Q_(O) +Q, in which Q is the maximum signal charge with respect to a photosensitive point.

Instead of the device shown in FIG. 5, a C.C.D. shift register, with parallel outputs, could also be used. Each of the parallel outputs of this register is connected by metal connections to one of the pairs of diodes D₁ -D₂, i.e. to one of the connections C₁ to C₄. During the reading time of a line from t₁ to t₅ -τ-- this register is addressed by the same control signals as the read register R₂. A charge Q_(o) is injected permanently at the input, so at the beginning from the line return time, t₅ -τ-- the charge Q_(o) is available at each stage of the register. This charge is the same for all the stages because it was generated by a single input stage and because the transfer inefficiency has a negligible effect on a constant signal. It is only the charge recombined in the substrate which introduces a dispersion but its value is generally very low.

When there is transfer of the signal-charge Q_(S) of the read line from diodes D₁ to diodes D₂ by the connections C₁ to C₄, at the same time, the C.C.D. register is laterally emptied. The charge Q_(o) is so superimposed to the signal for all the columns. It is the sum of charges Q_(o) +Q_(S) which is transferred in the reading register.

The transfer of charges in the C.C.D. shift register, with parallel outputs, which is used could be realized in surface or in bulk channels. The transfer in surface channel allows to transfer a more important charge Q_(o) for the same surface.

As shown in FIG. 5, this injection device allows to inject charge quantities Q_(o) identical for all the points of the photosensitive zone and independent from the values of the capacities c_(i) of the connections C_(i). The C.C.D. shift register is generally integrated on the same semiconductor substrate as the remainder of the photosensitive device.

Another embodiment of the memory, the parasitic charge removal device and the read register of the photosensitive device according to the invention will now be described, these parts being designated 2 and 3 in FIG. 1.

In this embodiment it was desired to transfer signal charges from the memory to the read register R₂ without using diodes like diodes D₄ and D₆ which are connected pairwise by metal connections outside substrate C'₁ to C'₄.

Thus, this embodiment has the advantage compared with that shown in FIG. 1 of eliminating interference liable to be introduced by a variable coupling of two photosensitive points between on the one hand each diode D₄ or D₆ and the adjacent grid G₄ or G₆ and on the other hand between each pair of diodes D₄ and D₆ (connection C'₁).

In this embodiment it was also desired to obtain a better uniformity of width l of grid G₂ raised to constant potential V₂ and which follows diodes D₂. It was also desirable to make same width l smaller.

Thus, this embodiment has the advantage of eliminating interference liable to be introduced by a variable penetration between individual photosensitive points of diodes D₂ beneath grid G₂. This variable penetration can lead to variable transfer times of the signal charges from each diode D₂ to the memory, due to the variable width of the grid of the equivalent MOS transistor across which the charges are transferred into the memory. Moreover, this embodiment has the advantage of increasing the speed of signal charge transfer from D₁ and D₂ into the memory, due to the reduction in width of G₂.

Finally this embodiment has the advantage of simplifying the control signals.

However, this embodiment imposes somewhat more severe manufacturing constraints as regards to the dimensions of the various components.

FIG. 7 is a diagrammatic plan view of this embodiment.

FIGS. 8 and 9a are cross-sectional views of the embodiment of FIG. 7.

Grid G₂ raised to constant potential V₂ is positioned after diodes D₂ connected by connnections C₁ to C₄ to reading diodes D₁. Grid G₂ is surrounded by two coplanar grids G₁₄ and G₄, maintained at a constant potential V'₄ higher than V₂. Thus, the width l of grid G₂ is determined in a single photogravure operation by the gap between the grids G₁₄ and G₄. Thus, a much better uniformity of width l is obtained and the width can also be greatly reduced.

Grid G₄, like grids G_(O) in FIG. 3 is a rectangular grid having rectangular slots.

FIG. 8a is a cross-sectional view of the embodiment of FIG. 7 in a smaller width area of G₄, i.e. level with a slot.

FIG. 9a, is a cross-sectional view of the embodiment of FIG. 7 in the gap between two notches. There is a removal diode D₅ in each substrate portion placed beneath a notch of G₄.

A U-shaped isolating diffusion area α₅ surrounds each diode D₅. This area determines two channels on each part of substrate 4 reserved by the diffusion zone d₂ for the processing of charges for one of the connections C₁ to C_(m). They consist of channel 1 (FIG. 9a) leading to the read register R₂, said access being regulated by a grid G₇ raised to a variable potential V'₇ and which is positioned astride between the end of G₄ and the start of R₂. The other channel 2 (FIG. 8a), which leads to the removal diode D₅, the latter then being common to two adjacent memory points for space-saving reasons.

Every other diode D₅ may be deleted. It allows either to have an horizontal pitch more reduced or to increase the storage capacity of the memory of line.

In this case, every other of the vertical parts of the diffusion zone d₂, i.e. the vertical parts which are not followed by a diode D₅, are prolonged and arrive to a storage electrode which doesn't receive charges.

The access to diode D₅ is then regulated by a rectangular electrode G₁₅ raised to a variable potential V₁₅. This electrode is astride the horizontal part of the notches of G₄. It is separated from G₄ by a not shown oxide layer. Potential V₁₅ is also applied to diodes D₅.

FIGS. 8a and 9a are cross-sectional views along channels 2 and 1.

The operation of this embodiment will now be studied with reference to FIGS. 8b, 8c and 9b, 9c representing the development of the surface potential in the semiconductor substrate 4a at different times t'₁, t'₂, t'₃. These times are marked on FIGS. 10a to 10d, which show the control signals liable to be applied in this embodiment.

In FIGS. 10c and 10d it is possible to see signals L_(i) and L_(i+1), already shown in FIGS. 4e and 4f. Signals V₁₅ and V₁₇ are shown in FIGS. 10a and 10b, being periodic of period T and vary between a low level and a high level. Signal V₁₅ is at high level when signals L_(i), L_(i+1) . . . and signal V'₇ are at low level.

Signals L_(i), L_(i+1) . . . pass to high level a moment τ after V₁₅ has passed to low level. Signal V'₇ passes to high level a moment τ after the passage of L_(i), L_(i+1) . . . to low level. Finally signal V'₇ returns to low level a moment τ before the passage of V₁₅ to high level.

Stage T₁ takes place as from the time when V₁₅ is at high level up to the time when L_(i), L_(i+1) . . . pass to high level. Stage T₂ takes place throughout the remainder of period T. Stages T₁ and T₂ will now be examined.

Stage T₁

At time t'₁ only signal V₁₅ is at high level.

FIG. 8b shows the surface potentials at this time.

The parasitic charges of all the photosensitive points are removed from diodes D₁ to diodes D₂, then beneath grid G₄ and finally beneath a removal diode D₅. Transfer takes place at constant potential V₂ -V_(T) as a result of grid G₂.

Stage T₂

At time t'₂ only signal L_(i) is at high level. FIGS. 8c and 9b show the surface potentials in the substrate at this time. The signal charges of line L_(i) are then transferred from diodes D₁ to diodes D₂, then stored beneath grid G₄ which serves as a memory.

At time t'₃ only signal V'₇ is at high level.

FIG. 9c shows the surface potential in the substrate at this time. There is then a transfer of signal charges from line L_(i) where they are stored below G₄ to beneath the read register R₂.

A new stage T₁ then starts, whilst line L_(i) is read by register R₂.

If read register R₂ is a register where there is a volume transfer of the charges, beneath the electrodes of the register there is a diffused area z which can stop in the centre of grid G₇. In this case the potential beneath register R₂ is higher than beneath G₄, which facilitates charge transfer.

Superimposing a fixed charge Q_(o) on signal charges Q_(S) can take place in the two ways indicated hereinbefore, i.e. by increasing the potential of G₂ at time t'₂ by ΔV or by using the device of FIGS. 5 and 6a to 6e. In this case the stage represented in FIG. 6e takes place at time t'hd 2.

It is obvious that the present invention generally relates to a photosensitive device integrated on to a silicon semiconductor substrate. It is also possible to integrate on to a silicon substrate photosensitive detectors made from some other material.

The device according to the invention is also able to operate, whilst giving results as good as those obtained by the device described in the I.E.E.E. article by transferring the signal charges as they arrive in the read register R₂, without storing them in the memory.

Finally the device according to the invention is preferably a CCD device, where there is a surface or volume charge transfer. 

What is claimed is:
 1. A photosensitive device read by charge transfer, wherein it hasn lines of m photosensitive points, each photosensitive point being constituted by the integration of a semiconductor substrate of an MOS capacitor (C_(O)), having a grid G₀ common to the points of the same line and a reading diode D₁ separated from grid G₀ by a screen grid G₁ raised to a constant potential (V₁), m metallic connections (C₁ . . . C_(m)) connecting in parallel n diodes belonging to different lines; m diodes D₂ integrated on to the same semiconductor substrate to which lead the m metallic connections, said diodes being followed by a grid G₂ raised to a constant potential (V₂); removing means on a diode (D₅) of the charges accumulated on diodes D₁ and D₂ during each time interval when none of the grids G₀ is at zero; at least one shift register (R₁) making it possible to periodically zero each grid G₀ and remove the signal charges on diodes D₁, and diodes D₂ ; means ensuring the transfer of the signal charges arriving beneath diodes D₂ to a charge transfer read register (R₂) with m parallel inputs and a series output.
 2. A device according to claim 1, wherein it has a memory integrated on to the semiconductor substrate following diodes D₂ and beneath which the signal charges are collected before being transferred into the read register (R₂).
 3. A device according to claim 2, wherein the memory is constituted by m diodes (D₄) followed by a grid (G₄) common to the m diodes and raised to a variable potential (V₄).
 4. A device according to claim 3, wherein it has integrated on to the substrate following the memory, a grid G₅ and a diode D₅ connected to a variable potential (V₅), said diode receiving the parasitic charges accumulated beneath diodes D₁ and D₂ during the time interval when no photosensitive grid G₀ was at zero.
 5. A device according to claim 4, wherein it has integrated on to the semiconductor substrate (4) m diodes D₆ followed by a single grid G₆ ; each of these diodes being connected by a metallic connection (C'₁ . . . C'_(m)) to the corresponding diode (D₄) of the memory and grid G₆ raised to the same variable potential (V₄) as grid (G₄) of the memory, a single grid G₇ raised to a variable potential (V₇) and the charge transfer read register (R₂), whose preceding grid G₇ permits the charging to take place after the signal charges resulting from the reading of a line have been collected by the memory.
 6. A device according to claim 5, wherein an oxide layer and an aluminium layer cover the diodes (D₄) of the memory and diodes D₆, as well as part of adjacent grids (G₄ and G₆), an electrical contact being established across the insulant level with each grid.
 7. A device according to claim 2, wherein a grid (G₃) raised to a variable potential (V₃) is intercalated between grid G₂ raised to a constant potential (V₂) and the memory on the semiconductor substrate.
 8. A device according to claim 2, wherein the grid G₂ is surrounded by two coplanar grids raised to a constant potential below V₂, one of these grids (G₁₄) being adjacent to diodes D₂ and the other grid G₄ constituting the memory.
 9. A device according to claim 8, wherein grid G₄ is a rectangular grid having rectangular notches, at least every other of each part of the substrate (4) placed beneath a notch has a charge removal diode (D₅), a U-shaped isolating diffusion area surrounds each charge removal diode (D₅) and definies two channels on that part of the substrate reserved for the processing of charges from one of the metallic connections (C₁ . . . C_(m)), one of the channels (channel 2) leading to a removal diode (D₅) permits the removal of parasitic charges accumulated beneath diodes D₁ and D₂ to below diode D₅ during the time interval when none of the photosensitive grids G₀ is at zero, said transfer being controlled by a grid (G₁₅) positioned astride the horizontal part of the notches of G₄, whilst the other channel (channel 1) makes it possible to transfer the signal charges from a line stored beneath grid G₄ into the charge transfer read register (R₂), said transfer being controlled by a grid (G₇) positioned astride the end of G₄ and the start of the register.
 10. A device according to claim 2, wherein the constant potential (V₂) applied to grid G₂ following diodes D₂ is increased by a constant quantity ΔV during the transfer of signal charges beneath the memory.
 11. A device according to claim 2, wherein it has, integrated on to the same semiconductor substrate m diodes (D₇) raised to a variable potential (V₇) followed by two coplanar grids G₈ and G₉ raised to two constant potentials V₈ and V₉, with V₈ lower than (V₉) in such a way that a quantity of constant charges (Q₀) is stored beneath G₉ during the passage of the potential applied to the diode from low level to high level, a grid (G₁₁) and a storage electrode (G₁₂) raised to a variable potential (V₁₁), a screen grid (G₁₃) raised to a constant potential (V₁₃) and m diodes D₁₃ connected by metallic connections (C"₁ . . . C"_(m)) to m diodes D₂, the quantity of charges (Q₀) being transferred beneath each diode D₁₃ during the transfer of signal charges beneath the memory.
 12. A device according to claim 2, wherein it comprises, integrated on the same substrate, a C.C.D. shift register comprising m parallel outputs, each output being connected by a metal connection to one of the pairs of diodes D₁ -D₂, this register receiving during the reading time of a line the same control signal as the read register (R₂) and a constant charge (Q_(o)) being injected permanently at the input and the register being emptied, when there is transfer of the signal-charges of the read line from the diodes D₁ to the diodes D₂.
 13. A device according to claim 1, wherein each photosensitive point has in the vicinity of the grid G₀ a collecting area (D₁₀) which is sensitive to the limited wavelengths to which G₀ is not sensitive, the charges created by the radiation on said areas (D₁₀) being collected beneath the grids G₀.
 14. A device according to claim 13, wherein each collecting area (D₁₀) is constituted by a single thin oxide area.
 15. A device according to claim 13, wherein each collecting area (D₁₀) is constituted by a diode.
 16. A device according to claim 15, wherein the diffusion zone corresponding to each diode constituting a collecting area (D₁₀) is extending under the adjacent grid G_(o).
 17. A device according to claim 1, wherein that part of the semiconductor substrate (4) carrying the photosensitive area (1) has a reduced thickness and is illuminated by its rear face.
 18. A device according to claim 1, wherein that part of the semiconductor substrate (4) which carries the photosensitive area (1) is illuminated by its front face and wherein the grids (G₀) are photosensitive and the reading diodes (D₁) are completely covered with aluminium.
 19. A device according to claim 1, wherein the reading diodes (D₁) are arranged in staggered manner and are positioned in rectangular notches made on the horizontal grids G₀.
 20. A device according to claim 19, wherein it has m vertical grids G₁ raised to potential V₁ partly covering on the one hand one of the vertical edges of each notch made on each grid G₀ and on the other hand each reading diode D₁ arranged in alternating manner from one line to the next to the right and left of the vertical electrode G₁.
 21. A device according to claim 20, wherein the m vertical grids G₁ are covered with an insulating layer on which are deposited the m metallic connections (C₁ to C_(m)) which, as a result of contacts through the insulating layer, connect in parallel n reading diodes D₁ belonging to n different grids G₀.
 22. A device according to claim 1, wherein the reading diodes D₁ and the diodes D₂ are arranged in matrix form.
 23. A device according to claim 1, wherein it has two shift registers, one of which addresses the lines of the even row and the other the lines of the uneven row.
 24. A device according to claim 1, wherein each grid G₀ is connected to one of the electrodes of an MOS transistor (T₀₁ . . . T_(0n)), whose grid is connected to a shift register (R₁) and whose other electrodes is connected to earth, the shift register periodically making each transistor conductive and zeroing each grid G₀.
 25. A device according to claim 1, wherein each grid G₀ is connected to one of the electrodes of an MOS transistor (T₁ . . . T_(n)), whose other electrode is connected to a constant potential (V₉) and whose grid receives a variable potential (V₈), which makes the conductors conductive and brings the grids G_(O) to constant potential (V₉) after the transfer of signal charges from one line into the charge transfer register (R₂) has taken place.
 26. A device according to claim 1, wherein each grid G₀ is connected to one of the electrodes of an MOS transistor (T₁ . . . T_(n)), whose other electrode is connected to a constant potential (V₉) and whose grid receives a constant potential, said transistors ensuring the restoration, after a time constant, of the constant potential (V₉) beneath the grids G₀ after the transfer of signal charges from one line into the charge transfer register (R₂) has taken place.
 27. A device according to claim 1, wherein the semiconductor substrate used is made from silicon.
 28. A charge transfer photosensitive read device comprisingn lines of m photosensitive points, each photosensitive point being constituted by the integration on a semiconductor substrate of a MOS capacitor (C₀), having a grid G₀ common to the points of the same line and a reading diode D₁ separated from grid G₀ by a screen grid G₁ raised to a constant potential (V₁), m metallic connections (C₁ . . . C_(m)) connecting in parallel n diodes belonging to different lines; m diodes D₂ integrated on to the same semiconductor substrate to which lead the m metallic connections, said diodes being followed by a grid G₂ raised to a constant potential (V₂); removing means on a diode (D₅) of the charges accumulated on diodes D₁ and D₂ during each time interval when none of the grids G₀ is at zero; at least one shift register (R₁) making it possible to periodically zero each grid G₀ and remove the signal charges on diodes D₁, and diodes D₂ ; means ensuring the transfer of the signal charges arriving beneath diodes D₂ to a charge transfer read register (R₂) with m parallel inputs and a series output; a memory integrated on to the semiconductor substrate following diodes D₂ and beneath which the signal charges are collected before being transferred into the read register (R₂).
 29. A charge transfer photosensitive read device comprisingn lines of m photosensitive points, each photosensitive point being constituted by the integration on a semiconductor substrate of a MOS capacitor (C₀), having a grid G₀ common to the points of the same line and a reading diode D₁ separated from grid G₀ by a screen grid G₁ raised to a constant potential (V₁), the reading diodes (D₁) being arranged in staggered manner and positioned in rectangular notches made on the horizontal grids G₀, m vertical grids G₁ raised to potential V₁ partly covering on the one hand one of the vertical edges of each notch made on each grid G₀ and on the other hand each reading diode D₁ arranged in alternating manner from one line to the next to the right and left of the vertical electrode G₁ and the m vertical grids G₁ being covered with an insulating layer on which are deposited the m metallic connections (C₁ to C_(m)) which, as a result of contacts through the insulating layer, connect in parallel n reading diodes D₁ belonging to n different grids G₀. m diodes D₂ integrated on to the same semiconductor substrate to which lead the m metallic connections, said diodes being followed by a grid G₂ raised to a constant potential (V₂); removing means on a diode (D₅) of the charges accumulated on diodes D₁ and D₂ during each time interval when none of the grids G₀ is at zero; at least one shift register (R₁) making it possible to periodically zero each grid G₀ and remove the signal charges on diodes D₁, and diodes D₂ ; means ensuring the transfer of the signal charges arriving beneath diodes D₂ to a charge transfer read register (R₂) with m parallel inputs and a series output.
 30. A charge transfer photosensitive read device comprisingn lines of m photosensitive points, each photosensitive point being constituted by the integration on a semiconductor substrate of a MOS capacitor (C₀), having a grid G₀ common to the points of the same line and a reading diode D₁ separated from grid G₀ by a screen grid G₁ raised to a constant potential (V₁), m metallic connections (C₁ . . . C_(m)) connecting in parallel n diodes belonging to different lines; m diodes D₂ integrated on to the same semiconductor substrate to which lead the m metallic connections, said diodes being followed by a grid G₂ raised to a constant potential (V₂); removing means on a diode (D₅) of the charges accumulated on diodes D₁ and D₂ during each time interval when none of the grids G₀ is at zero; at least one shift register (R₁) making it possible to periodically zero each grid G₀ and remove the signal charges on diodes D₁, and diodes D₂ ; means ensuring the transfer of the signal charges arriving beneath diodes D₂ to a charge transfer read register (R₂) with m parallel inputs and a series output; a memory integrated on to the semiconductor substrate following diodes D₂ and beneath which the signal charges are collected before being transferred into the read register (R₂), the grid G₂ being surrounded by two coplanar grids raised to a constant potential below V₂, one of these grids (G₁₄) being adjacent to diodes D₂ and the other grid G₄ constituting the memory, said grid G₄ being a rectangular grid having rectangular notches, at least every other of each part of the substrate (4) placed beneath a notch has a charge removal diode (D₅), a U-shaped isolating diffusion area surrounds each charge removal diode (D₅) and definies two channels on that part of the substrate reserved for the processing of charges from one of the metallic connections (C₁ . . . C_(m)), one of the channels (channels 2) leading to a removal diode (D₅) permits the removal of parasitic charges accumulated beneath diodes D₁ and D₂ to below diode D₅ during the time interval when none of the photosensitive grids G₀ is at zero, said transfer being controlled by a grid (G₁₅) positioned astride the horizontal part of the notches of G₄, whilst the other channel (channel 1) makes it possible to transfer the signal charges from a line stored beneath grid G₄ into the charge transfer read register (R₂), said transfer being controlled by a grid (G₇) positioned astride the end of G₄ and the start of the register.
 31. A charge transfer photosensitive read device comprisingn lines of m photosensitive points, each photosensitive point being constituted by the integration on a semiconductor substrate of a MOS capacitor (C₀), having a grid G₀ common to the points of the same line and a reading diode D₁ separated from grid G₀ by a screen grid G₁ raised to a constant potential (V₁), m metallic connections (C₁ . . . C_(m)) connecting in parallel n diodes belonging to different lines, each photosensitive point having in the vicinity of the grid G₀ a collecting area (D₁₀) which is sensitive to the limited wavelengths to which G₀ is not sensitive, the charges created by the radiation on said areas (D₁₀) being collected beneath the grids G₀. m diodes D₂ integrated on to the same semiconductor substrate to which lead the m metallic connections, said diodes being followed by a grid G₂ raised to a constant potential (V₂); removing means on a diode (D₅) of the charges accumulated on diodes D₁ and D₂ during each time interval when none of the grids G₀ is at zero; at least one shift register (R₁) making it possible to periodically zero each grid G₀ and remove the signal charges on diodes D₁, and diodes D₂ ; means ensuring the transfer of the signal charges arriving beneath diodes D₂ to a charges transfer read register (R₂) with m parallel inputs and a series output.
 32. A device according to claim 31, wherein it has a memory integrated on to the semiconductor substrate following diodes D₂ and beneath which the signal charges are collected before being transferred into the read register (R₂).
 33. A device according to claim 31, wherein each collecting area (D₁₀) is constituted by a single thin oxide area.
 34. A device according to claim 31, wherein each collecting area (D₁₀) is constituted by a diode.
 35. A device according to claim 31, wherein the diffusion zone corresponding to each diode constituting a collecting area (D₁₀) is extending under the adjacent grid G₀. 